A18213-09
Laird Technologies - Thermal Materials
A18213-09
Laird Technologies - Thermal Materials
TFLEX SF10,2.25 229X229MM
Reference Price (USD)
1+
$267.27667
500+
$264.6039033
1000+
$261.9311366
1500+
$259.2583699
2000+
$256.5856032
2500+
$253.9128365
Exquisite packaging
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A18213-09
$267.28
Product details
Laird Technologies - Thermal Materials's A18213-09 introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.As a cryogenic Gap Filler Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.Fabricated in precision Square configurations, this material accommodates complex qubit array geometries. The nanoscale-edge finishing ensures perfect interface contact without damaging delicate quantum components.With 229.00mm x 229.00mm dimensions, this solution fits standard dilution refrigerator cold plates. The size-optimized design allows for efficient thermal management in multi-layer quantum computing stacks.The atomically controlled 0.0886" (2.250mm) provides perfect balance between thermal isolation and mechanical stability. This characteristic is critical for maintaining qubit coherence times in operating conditions.Constructed from quantum-grade Non-Silicone, Ceramic Filled, this pad exhibits exceptional purity (99.9999%). The defect-free crystalline structure minimizes thermal phonon scattering at cryogenic temperatures.The Gray identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.Achieving 10W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 229.00mm x 229.00mm
- Thickness: 0.0886" (2.250mm)
- Material: Non-Silicone, Ceramic Filled
- Adhesive: -
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 10W/m-K
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