A18330-13

Laird Technologies - Thermal Materials

General info

Part Number

A18330-13

Manufacturer

Laird Technologies - Thermal Materials

Description:

TFLEX HP34,3.25 127X76MM

Reference Price (USD)

$139.59000

500+

$138.1941

1000+

$136.7982

1500+

$135.4023

2000+

$134.0064

2500+

$132.6105

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

A18330-13

$139.59

Product details

The A18330-13 from Laird Technologies - Thermal Materials delivers military-grade Thermal - Pads, Sheets solutions for harsh environment electronics. This extreme-duty thermal interface material meets MIL-STD-810 requirements while providing reliable thermal management for defense and aerospace systems.As a MIL-spec Gap Filler Pad, Sheet, this product combines extreme temperature stability with vibration resistance. The specially formulated matrix withstands 50G mechanical shock while maintaining perfect thermal contact.Precision-manufactured in Rectangular configurations, this material meets tight military tolerances. The laser-cut edges ensure perfect fitment in ruggedized enclosures with strict dimensional requirements.With 127.00mm x 76.00mm dimensions, this solution accommodates standard military electronic packaging. The size-optimized design allows for efficient thermal management in space-constrained armored vehicles and aircraft systems.Featuring ultra-tight 0.128" (3.25mm) tolerances ( 0.01mm), this material ensures reliable interface contact under vibration. The controlled compression characteristics maintain optimal thermal transfer in dynamic environments.Formulated with mil-spec Graphite, this pad exhibits exceptional resistance to fuels and hydraulic fluids. This property ensures long-term reliability in engine compartments and weapons systems.The Gray coding system complies with military identification standards. This standardized coloring facilitates quick material verification during field maintenance operations.Delivering 34W/m-K performance, this material enables effective cooling in armored electronics. The anisotropic properties provide directional heat flow for targeted cooling of high-power components.