A18444-04
Laird Technologies - Thermal Materials
A18444-04
Laird Technologies - Thermal Materials
TFLEX HD7.5,1.00 9X9IN,
Reference Price (USD)
1+
$92.80000
500+
$91.872
1000+
$90.944
1500+
$90.016
2000+
$89.088
2500+
$88.16
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
A18444-04
$92.80
Product details
The A18444-04 by Laird Technologies - Thermal Materials sets new benchmarks in Thermal - Pads, Sheets technology for automotive electronics. This ruggedized thermal solution combines exceptional durability with industry-leading thermal performance, making it ideal for under-hood applications and electric vehicle power systems.As a high-performance Gap Filler Pad, Sheet, this product offers superior conformability to irregular surfaces. The viscoelastic properties ensure maximum interface contact even with components exhibiting surface warpage or roughness.Manufactured in precision Square configurations, this material facilitates efficient thermal pathway design. The optimized geometries minimize thermal impedance while accommodating space constraints in compact automotive modules.Standard 228.60mm x 228.60mm dimensions ensure compatibility with common power electronics packaging. The size-optimized design allows for efficient thermal management without requiring custom tooling.Formulated with advanced Silicone, Ceramic Filled technology, this pad exhibits exceptional resistance to automotive fluids and chemicals. This property ensures long-term reliability in harsh operating environments.The Gray identification system enables quick visual verification during quality inspections. This feature is particularly valuable in high-volume manufacturing environments.Delivering 7.5W/m-K performance, this material enables more efficient thermal designs. The isotropic properties ensure uniform heat spreading across the entire interface area.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 228.60mm x 228.60mm
- Thickness: -
- Material: Silicone, Ceramic Filled
- Adhesive: -
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 7.5W/m-K
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