A2F060M3E-1FGG256I
Microsemi Corporation
A2F060M3E-1FGG256I
Microsemi Corporation
IC SOC CORTEX-M3 100MHZ 256FBGA
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Product details
The A2F060M3E-1FGG256I by Microsemi Corporation is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The ARM® Cortex®-M3 core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.128KB of flash memory provides sufficient storage for machine learning models and over-the-air update capabilities in remote deployments.With 16KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DMA, POR, WDT include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The EBI/EMI, I²C, SPI, UART/USART options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 100MHz, the processor balances performance with power efficiency for always-on sensing applications.ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 256-LBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 256-FPBGA (17x17), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Obsolete
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 128KB
- RAM Size: 16KB
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, I²C, SPI, UART/USART
- Speed: 100MHz
- Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FPBGA (17x17)
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