A42MX36-1CQ208B
Microchip Technology
A42MX36-1CQ208B
Microchip Technology
IC FPGA 176 I/O 208CQFP
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$12959.76000
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$12830.1624
1000+
$12700.5648
1500+
$12570.9672
2000+
$12441.3696
2500+
$12311.772
Exquisite packaging
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Product details
Designed for next-generation automotive electronics, Microchip Technology's A42MX36-1CQ208B sets new standards in Embedded - FPGAs (Field Programmable Gate Array) for reliability and performance. This radiation-hardened FPGA meets stringent automotive qualification requirements while delivering the computational power needed for autonomous driving subsystems. The architecture incorporates triple-redundant voting logic and SEU-resistant memory for functional safety applications.With 2560 bits of protected memory, the device can buffer multiple sensor data streams simultaneously. The ECC-protected memory architecture detects and corrects transient errors caused by automotive electrical noise environments.The 176 automotive-grade I/Os support 12V fault tolerance and include built-in current limiting. Each I/O bank can be independently configured for LIN/CAN FD/FlexRay interface protocols common in vehicle networks.The 54000 equivalent gate count provides sufficient resources for implementing complex sensor fusion algorithms. The hardened multipliers and accumulators accelerate matrix operations common in machine vision processing.Operating from 3V ~ 3.6V, 4.5V ~ 5.5V, the power architecture includes load-dump protection and reverse polarity safeguards. The adaptive body biasing technique reduces leakage current during extended vehicle standby periods.The Surface Mount package meets automotive vibration specifications while maintaining reliable connections under thermal cycling. The solder joint design has been optimized for lead-free assembly processes required in modern vehicle electronics.Qualified for -55°C ~ 125°C (TJ) operation, the device maintains timing margins across the full automotive temperature range. The thermal shutdown circuitry prevents damage during extended exposure to under-hood conditions.The 208-BFCQFP with Tie Bar package incorporates copper heat spreaders for efficient thermal management in confined automotive modules. The mold compound has been formulated for resistance to automotive fluids and cleaning agents.Supplied in 208-CQFP (75x75) configuration, the device includes automotive-grade moisture sensitivity labeling. The tape-and-reel packaging complies with automated assembly requirements for high-volume vehicle production.
Product Attributes
- Product Status: Active
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: 2560
- Number of I/O: 176
- Number of Gates: 54000
- Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 125°C (TJ)
- Package / Case: 208-BFCQFP with Tie Bar
- Supplier Device Package: 208-CQFP (75x75)