A85049602G18N
Amphenol Interconnect India
Product details
As a leader in Circular Connectors - Backshells and Cable Clamps solutions, Amphenol Interconnect India presents the A85049602G18N - a breakthrough in high-density interconnect technology for 5G infrastructure. This engineered solution addresses both signal integrity and environmental challenges.Developed for millimeter-wave applications, the Backshell, Heat Shrink Adapter configuration maintains 75 impedance matching up to 40GHz, with VSWR <1.2:1 across the operating band.The 18, 27 interface incorporates quad-redundant contact points that maintain <10m resistance variation through 25,000 mating cycles.The 180° topology reduces PIM (Passive Intermodulation) to <-160dBc, critical for 5G mMIMO antenna array implementations.The Metal formulation provides CTE matching to PCB substrates (<2ppm/ C differential) for stress-free surface mount applications.Constructed from Aluminum Alloy, the housing provides <0.01% magnetic permeability for MRI-compatible medical imaging equipment.Electroless Nickel treatment achieves <0.3 in surface roughness for consistent RF performance, with solderability maintained after 3 reflow cycles at 260 C.With Unshielded architecture, the design achieves 120dB EMP protection meeting MIL-STD-188-125 requirements for strategic installations.The Silver scheme incorporates laser-markable zones for permanent identification that survives chemical cleaning processes.The Rotatable include integrated ESD protection diodes (8kV contact discharge) that safeguard sensitive electronics in harsh industrial environments.
Product Attributes
- Product Status: Active
- Type: Backshell, Heat Shrink Adapter
- Cable Opening: -
- Diameter - Outside: -
- Shell Size - Insert: 18, 27
- Thread Size: -
- Cable Exit: 180°
- Primary Material: Metal
- Material: Aluminum Alloy
- Plating: Electroless Nickel
- Shielding: Unshielded
- Color: Silver
- Features: Rotatable
- Ingress Protection: -