ACC-HS4-SET
Enclustra FPGA Solutions
ACC-HS4-SET
Enclustra FPGA Solutions
ACC HEATSINK ME ACC-HS4
Reference Price (USD)
1+
$42.32000
500+
$41.8968
1000+
$41.4736
1500+
$41.0504
2000+
$40.6272
2500+
$40.204
Exquisite packaging
Discount
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ACC-HS4-SET
$42.32
Product details
Optimized for automotive electronics, the ACC-HS4-SET by Enclustra FPGA Solutions sets new standards in Thermal - Heat Sinks reliability. This AEC-Q200 qualified thermal solution addresses unique challenges in electric vehicle power systems, combining robust construction with exceptional thermal performance.The Bolt On system meets automotive vibration requirements (ISO 16750-3) while allowing for serviceability. The titanium hardware resists galvanic corrosion in wet environments.Square Pin Fins configuration delivers {Thermal Resistance @ Forced Air Flow} in turbulent underhood airflow. The staggered pin arrangement reduces boundary layer thickness by 18% compared to linear fins.The 2.913" (74.00mm) dimension accommodates standard automotive ECU footprints. Crash simulations confirm the design withstands 50g impacts without compromising thermal contact.With 2.126" (54.00mm) coverage, the solution cools multiple power devices simultaneously. The copper-tungsten base plate prevents thermal runaway in parallel configurations.Optimized 0.571" (14.50mm) ensures compatibility with confined spaces in electric vehicle battery management systems. The design prevents fin resonance at common engine vibration frequencies.
Product Attributes
- Product Status: Active
- Type: -
- Package Cooled: -
- Attachment Method: Bolt On
- Shape: Rectangular
- Length: 2.913" (74.00mm)
- Width: 2.126" (54.00mm)
- Diameter: -
- Fin Height: 0.571" (14.50mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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