ADBF704WCCPZ411
Analog Devices Inc.
ADBF704WCCPZ411
Analog Devices Inc.
BLACKFIN+ PROCESSOR W/ 512KB L2
Reference Price (USD)
1+
$21.95000
500+
$21.7305
1000+
$21.511
1500+
$21.2915
2000+
$21.072
2500+
$20.8525
Exquisite packaging
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Product details
Analog Devices Inc.'s ADBF704WCCPZ411 delivers cutting-edge Embedded - DSP (Digital Signal Processors) performance for aerospace and defense applications. This ruggedized DSP solution combines radiation hardness with cryptographic acceleration, making it ideal for satellite communications and avionics signal processing.The Blackfin+ architecture incorporates radiation-hardened by design (RHBD) techniques for space applications. Its SC140 Core configuration provides the fault-tolerant computing required for orbital navigation systems.Military-grade CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG implementation includes radiation-tolerant SERDES links for space data buses. The interface subsystem incorporates triple modular redundancy for single-event upset (SEU) protection.Operating at 400MHz, the processor meets the timing requirements of phased array radar systems. The radiation-hardened PLL maintains clock stability in high-altitude environments.The ROM (512kB) subsystem employs SEE mitigation techniques for spaceborne applications. Error-correcting codes protect configuration data from cosmic ray-induced bit flips.With 512kB capacity, the DSP handles multiple radar channels in airborne early warning systems. The memory incorporates scrubber circuits for continuous error correction.The 1.8V, 3.3V implementation supports military power supply variations in field-deployed equipment. The I/O cells include EMP hardening for electromagnetic pulse protection.The 1.10V domain implements fault-tolerant power sequencing for aerospace systems. Redundant voltage monitors ensure reliable operation during power transients.Qualified for -40°C ~ 105°C (TA), the device operates reliably in satellite thermal environments. The extended temperature testing includes orbital thermal cycling profiles.The Surface Mount configuration meets military PCB assembly standards for high-reliability applications. The package design prevents tin whisker growth in long-duration missions.Housed in 88-VFQFN Exposed Pad, CSP, the processor meets outgassing requirements for vacuum operation. The package materials are compliant with NASA low-outgassing specifications.Available in 88-LFCSP-VQ (12x12), this space-qualified DSP undergoes MIL-STD-883 testing. The package includes lot traceability and radiation test data for space programs.
Product Attributes
- Product Status: Active
- Type: Blackfin+
- Interface: CAN, DSPI, EBI/EMI, I²C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate: 400MHz
- Non-Volatile Memory: ROM (512kB)
- On-Chip RAM: 512kB
- Voltage - I/O: 1.8V, 3.3V
- Voltage - Core: 1.10V
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 88-VFQFN Exposed Pad, CSP
- Supplier Device Package: 88-LFCSP-VQ (12x12)