APA1000-BG456M
Microchip Technology
APA1000-BG456M
Microchip Technology
IC FPGA 356 I/O 456BGA
Reference Price (USD)
1+
$4739.07000
500+
$4691.6793
1000+
$4644.2886
1500+
$4596.8979
2000+
$4549.5072
2500+
$4502.1165
Exquisite packaging
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Product details
Microchip Technology's APA1000-BG456M redefines wireless communication capabilities in Embedded - FPGAs (Field Programmable Gate Array), engineered for 5G base stations and millimeter-wave applications. This FPGA combines ultra-low latency processing with high-speed serial transceivers, enabling next-generation network infrastructure. The architecture features advanced equalization techniques to compensate for channel impairments in RF signal chains.Providing 202752 bits of low-latency memory, this FPGA buffers high-speed sample data without pipeline stalls. The memory subsystem features configurable interleaving for optimal access patterns in signal processing applications.The 356 high-speed I/Os support multiple industry-standard protocols including JESD204B/C. Each I/O bank incorporates adaptive equalization to compensate for PCB transmission line losses.The 1000000 equivalent gate capacity enables implementation of complete digital predistortion algorithms. The hardened DSP blocks accelerate complex number processing for beamforming applications.The 2.3V ~ 2.7V operating range has been optimized for power amplifier linearization applications. The integrated voltage regulators maintain precise supply levels for sensitive RF circuitry.The Surface Mount mounting solution ensures reliable operation in outdoor telecommunication equipment. The package design incorporates stress-relief features for thermal cycling endurance.Qualified for -55°C ~ 125°C (TC) operation, the device maintains consistent performance across cellular base station environments. The thermal management system prevents performance degradation during peak traffic loads.The 456-BBGA package implements advanced RF shielding techniques for sensitive receiver applications. The low-loss dielectric material minimizes signal attenuation at millimeter-wave frequencies.Delivered in 456-PBGA (35x35) format, the device meets stringent wireless infrastructure reliability requirements. The packaging includes ESD protection for handling during installation.
Product Attributes
- Product Status: Active
- Number of LABs/CLBs: -
- Number of Logic Elements/Cells: -
- Total RAM Bits: 202752
- Number of I/O: 356
- Number of Gates: 1000000
- Voltage - Supply: 2.3V ~ 2.7V
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 125°C (TC)
- Package / Case: 456-BBGA
- Supplier Device Package: 456-PBGA (35x35)