AT91R40807-33AI

Microchip Technology

General info

Part Number

AT91R40807-33AI

Manufacturer

Microchip Technology

Description:

IC MCU 16/32BIT ROMLESS 100LQFP

Datasheet:

AT91R40807-33AI PDF AT91R40807-33AI Datasheet

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Product details

Microchip Technology's AT91R40807-33AI delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The ARM7® core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 16/32-Bit architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.When operating at 33MHz, the microcontroller maintains timing accuracy within 0.01% despite temperature variations from -55 C to 125 C, critical for navigation systems.The EBI/EMI, UART/USART interfaces implement Manchester encoding for noise-immune data transmission, ensuring reliable communication in high-EMI environments like radar installations.WDT include radiation-hardened timers and watchdog circuits that automatically recover from single-event functional interrupts within 10 s.With 32 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.The ROMless implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.136K x 8 of scrubable memory prevents accumulation of single-event upsets, maintaining data integrity during extended missions in high-radiation orbits.The 1.8V ~ 3.6V range supports operation from unregulated spacecraft power buses with 100mV ripple, eliminating need for additional regulation stages.The External clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Qualified for -40°C ~ 85°C (TA), the device operates reliably in exoatmospheric conditions where thermal cycling extremes exceed commercial specifications.Surface Mount packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 100-LQFP format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 100-LQFP (14x14), the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.