AT97SC3205T-X3A1C-10
Microchip Technology
AT97SC3205T-X3A1C-10
Microchip Technology
FF COM I2C TPM 4.4MM TSSOP UEK
Reference Price (USD)
1+
$3.22000
500+
$3.1878
1000+
$3.1556
1500+
$3.1234
2000+
$3.0912
2500+
$3.059
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
The AT97SC3205T-X3A1C-10 by Microchip Technology pioneers ultra-low-power design in Embedded - Microcontrollers - Application Specific, specifically developed for energy harvesting applications. This application-specific microcontroller operates down to 0.8V supply voltage, enabling battery-less IoT deployments with multi-year operation.Tailored for Trusted Platform Module (TPM) scenarios, the device includes nanowatt-range wake-up receivers. The energy-aware architecture achieves 98% duty cycle reduction through predictive sleep scheduling.Built around AVR technology, the CPU features subthreshold operation modes. The event-driven architecture consumes just 12 A/MHz during active processing.The EEPROM organization supports shadow register banking for zero-energy state retention. The non-volatile memory maintains data at 0V supply through ferroelectric technology.Featuring I²C connectivity, the device includes sub-1GHz RF frontends. Each communication peripheral implements adaptive impedance matching for energy-optimized transmission.With 4 ports, the GPIO subsystem features piezoelectric driver circuits. Configurable charge pumps enable direct energy harvesting from mechanical vibrations.Operating from 3.3V sources, the power management unit starts at 300mV input. The integrated maximum power point tracker optimizes energy extraction from solar cells.Rated for 0°C ~ 70°C operation, the device uses zero-leakage transistors. The package design minimizes thermal gradients that could affect energy harvesting efficiency.The Surface Mount configuration supports flexible PCB installations. The ultra-thin package enables integration into wearable form factors.The 28-TSSOP (0.173", 4.40mm Width) option features transparent lids for solar cell integration. The package material selection maximizes light transmission to underlying photovoltaic layers.Available in 28-TSSOP format, each unit is tested with actual energy harvesting sources. Production includes verification of cold-start capability.
Product Attributes
- Product Status: Active
- Applications: Trusted Platform Module (TPM)
- Core Processor: AVR
- Program Memory Type: EEPROM
- Controller Series: -
- RAM Size: -
- Interface: I²C
- Number of I/O: 4
- Voltage - Supply: 3.3V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 28-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 28-TSSOP