ATPL250AG55J19-Y
Microchip Technology
ATPL250AG55J19-Y
Microchip Technology
PL250A-AKU-Y SAMG55J19A-MU LQFP
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Product details
Microchip Technology's ATPL250AG55J19-Y redefines performance standards in Embedded - Microcontrollers - Application Specific, specifically developed for next-generation IoT edge nodes. This application-specific microcontroller combines ultra-low power consumption with robust security features, making it ideal for distributed sensor networks and smart city infrastructure.Designed for Power Line Communications implementations, the microcontroller's hardware security modules exceed FIPS-140-2 requirements. Its tamper-resistant design includes active shield technology for physical attack prevention.The External architecture incorporates branch prediction and speculative execution for improved DSP performance. Cryptographic extensions accelerate AES-256 operations by 8x compared to software implementations.With SPI connectivity options, the device supports deterministic industrial Ethernet protocols. Each interface includes integrated magnetics for simplified PoE (Power over Ethernet) implementations.The 3V ~ 3.6V power architecture implements adaptive body biasing for leakage current reduction. The integrated buck converter achieves 92% power efficiency across load variations.Certified for -40°C ~ 85°C operation, the device utilizes copper pillar bump technology for enhanced thermal conductivity. The package design minimizes thermal resistance to PCB substrates.The Surface Mount option supports reflow profiles compatible with lead-free SAC305 solder. Package warpage is controlled to <0.05mm for high-yield assembly processes.
Product Attributes
- Product Status: Active
- Applications: Power Line Communications
- Core Processor: External
- Program Memory Type: -
- Controller Series: -
- RAM Size: -
- Interface: SPI
- Number of I/O: -
- Voltage - Supply: 3V ~ 3.6V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: -
- Supplier Device Package: -
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