ATS-11E-35-C2-R0
Advanced Thermal Solutions Inc.
ATS-11E-35-C2-R0
Advanced Thermal Solutions Inc.
HEATSINK 36.83X57.6X5.84MM T766
Reference Price (USD)
1+
$9.14000
500+
$9.0486
1000+
$8.9572
1500+
$8.8658
2000+
$8.7744
2500+
$8.683
Exquisite packaging
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ATS-11E-35-C2-R0
$9.14
Product details
The ATS-11E-35-C2-R0 from Advanced Thermal Solutions Inc. sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.The Pressure-Sensitive Adhesive system allows for tool-less installation with consistent bond strength (3-5N/cm ). The adhesive maintains performance across -20 C to +85 C operating range.Micro-Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in ultra-thin airflow channels. The 0.3mm fin pitch creates optimal boundary layer disruption for maximum heat transfer.The 1.450" (36.83mm) dimension fits within 5mm device profiles while providing sufficient thermal mass. The design prevents hot spot formation in corner-loaded scenarios.With 2.267" (57.60mm) coverage, the solution cools multiple heat sources simultaneously. Thermal imaging shows less than 4 C variation across the entire surface area.Precision 0.230" (5.84mm) of just 0.5mm enables integration in sub-8mm device profiles. The nanostructured surface enhances heat transfer coefficient by 15%.The 22.48°C/W @ 100 LFM performance is optimized for low-speed fans (<5 CFM). The design maintains acoustic levels below 25dBA in typical usage scenarios.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.Black PVD coating ensures aesthetic consistency with consumer electronics while improving radiative cooling. The finish meets MIL-STD-810G abrasion resistance requirements.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Push Pin
- Shape: Rectangular, Fins
- Length: 1.450" (36.83mm)
- Width: 2.267" (57.60mm)
- Diameter: -
- Fin Height: 0.230" (5.84mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 22.48°C/W @ 100 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: Blue Anodized
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