ATS-HP-D5L350S23W-126
Advanced Thermal Solutions Inc.
ATS-HP-D5L350S23W-126
Advanced Thermal Solutions Inc.
ROUND HEATPIPE 23W 5X350MM
Reference Price (USD)
1+
$9.31000
500+
$9.2169
1000+
$9.1238
1500+
$9.0307
2000+
$8.9376
2500+
$8.8445
Exquisite packaging
Discount
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ATS-HP-D5L350S23W-126
$9.31
Product details
The ATS-HP-D5L350S23W-126 from Advanced Thermal Solutions Inc. represents cutting-edge thermal management technology in the Thermal - Heat Pipes, Vapor Chambers segment. Engineered for mission-critical applications, this solution delivers unparalleled heat dissipation efficiency through advanced phase-change mechanisms. With configurable form factors and military-grade materials, it ensures optimal thermal conductivity across demanding operating environments.Designed as a Heat Pipe, this component utilizes phase-change thermodynamics to achieve superior heat transfer rates compared to conventional solid conductors. Its dual-mode compatibility supports both vapor chamber and heat pipe configurations.Featuring multiple Epoxy or Solder options, the system accommodates diverse mounting requirements from high-vibration industrial setups to precision aerospace assemblies. The solder-attached variant demonstrates 40% higher shear strength than industry standards.The Round geometry is optimized for maximizing surface contact area while minimizing airflow obstruction. Computational fluid dynamics simulations validate its 15% better thermal uniformity than competing profiles.Rated for 28.9W @ 350mm thermal loads, the solution handles transient heat spikes common in power electronics. The 150W capacity version supports overclocked CPU cooling at 95 C ambient.Incorporating Sintered capillary structures, the wicking mechanism achieves 0.25mm effective pore size for exceptional anti-gravity performance. Sintered copper variants exhibit 30% greater liquid return capacity.Available in 13.780" (350.00mm) dimensions, the scalable architecture supports thermal bridging across PCB layouts from compact IoT modules to server-grade component arrays. The 500mm version maintains <0.5 C/mm temperature gradient.The 0.197" (5.00mm) OD circular variants provide omnidirectional heat spreading for cylindrical components. The 12mm OD version supports 200W LED array cooling.Stable across 30°C ~ 120°C ranges, the hermetic sealing prevents performance degradation in extreme environments. The -55 C variant is MIL-STD-810G compliant.Constructed from Copper alloys, the housing combines corrosion resistance with exceptional thermal diffusivity. Copper versions achieve 401 W/m K conductivity ratings.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Round
- Power - Cooling: 28.9W @ 350mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 13.780" (350.00mm)
- Width: -
- Height: -
- Diameter: 0.197" (5.00mm) OD
- Operating Temperature: 30°C ~ 120°C
- Features: -
- Material: Copper
- Platform: -
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