ATS-HP-F8L75S91W-454
Advanced Thermal Solutions Inc.
ATS-HP-F8L75S91W-454
Advanced Thermal Solutions Inc.
FLAT HEATPIPE 91W 9.5X6.5X75MM
Reference Price (USD)
1+
$10.67000
500+
$10.5633
1000+
$10.4566
1500+
$10.3499
2000+
$10.2432
2500+
$10.1365
Exquisite packaging
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ATS-HP-F8L75S91W-454
$10.67
Product details
Advanced Thermal Solutions Inc.'s ATS-HP-F8L75S91W-454 redefines thermal management benchmarks in the Thermal - Heat Pipes, Vapor Chambers category. Optimized for next-generation computing architectures, this thermal solution combines innovative wick structures with military-spec construction for reliable operation in harsh conditions.Functioning as a Heat Pipe, the device employs two-phase heat transfer principles to achieve 5x better thermal conductivity than copper blocks. The vapor chamber variant features micro-channel reinforcement for 400W+ applications.Supporting Epoxy or Solder installation techniques, the system accommodates both permanent and serviceable thermal interfaces. Epoxy-mounted versions demonstrate 1000+ thermal cycles reliability.The Flat configuration is aerodynamically optimized for forced convection systems. Rectangular profiles show 18% lower pressure drop in wind tunnel tests.Capable of handling 113.4W @ 75mm thermal loads, the solution manages heat flux densities up to 300W/cm . The 110W model is ideal for FPGA cooling.Utilizing Sintered fluid transport technology, the capillary action maintains continuous phase-change cycles. Grooved designs achieve 0.15mm effective pore size for high-G applications.Available in 2.953" (75.00mm) variants, the modular design enables custom thermal path optimization. The 450mm version is specifically engineered for rack-mounted server cooling.Precision-machined to 0.372" (9.45mm) specifications, the contact surfaces ensure <0.01mm flatness for optimal TIM performance. The 56mm variant supports chipset array cooling.With 0.256" (6.50mm) vertical clearance, the ultra-slim profile fits 1U chassis configurations while maintaining 100W cooling capacity.Reliable across 30°C ~ 120°C extremes, the solution features aerospace-grade sealing. The 180 C variant is qualified for under-hood automotive applications.Fabricated from Copper substrates, the construction balances weight and performance. Aluminum versions achieve 230 W/m K conductivity at 40% weight reduction.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Flat
- Power - Cooling: 113.4W @ 75mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 2.953" (75.00mm)
- Width: 0.372" (9.45mm)
- Height: 0.256" (6.50mm)
- Diameter: -
- Operating Temperature: 30°C ~ 120°C
- Features: -
- Material: Copper
- Platform: -
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