ATS-PCB1074
Advanced Thermal Solutions Inc.
ATS-PCB1074
Advanced Thermal Solutions Inc.
HEATSINK TO-263 COPPER
Reference Price (USD)
1+
$1.45000
500+
$1.4355
1000+
$1.421
1500+
$1.4065
2000+
$1.392
2500+
$1.3775
Exquisite packaging
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ATS-PCB1074
$1.45
Product details
Advanced Thermal Solutions Inc.'s ATS-PCB1074 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Optimized for LGA 4677 sockets, the solution manages {Power Dissipation @ Temperature Rise} at server inlet temperatures up to 45 C. The thermal interface maintains performance through 50,000 insertion cycles.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 0.500" (12.70mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 1.031" (26.20mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 0.401" (10.20mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 9.50°C/W @ 200 LFM performance is validated under ASHRAE TC9.9 Class A3 conditions. The design maintains stability at airflow rates from 10-25 CFM.The 18.00°C/W specification enables emergency operation during cooling system failures. The design maintains processors below 90 C for 15 minutes without airflow.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: TO-263 (D²Pak)
- Attachment Method: -
- Shape: Rectangular, Fins
- Length: 0.500" (12.70mm)
- Width: 1.031" (26.20mm)
- Diameter: -
- Fin Height: 0.401" (10.20mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 9.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: 18.00°C/W
- Material: Copper
- Material Finish: Tin
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