ATS-UC-QFLOW-200
Advanced Thermal Solutions Inc.
ATS-UC-QFLOW-200
Advanced Thermal Solutions Inc.
QUADFLOW HEATSINK 1U CU FINS
Reference Price (USD)
1+
$160.87000
500+
$159.2613
1000+
$157.6526
1500+
$156.0439
2000+
$154.4352
2500+
$152.8265
Exquisite packaging
Discount
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ATS-UC-QFLOW-200
$160.87
Product details
Advanced Thermal Solutions Inc.'s ATS-UC-QFLOW-200 offers military-grade thermal solutions in the Thermal - Heat Sinks segment, specifically developed for aerospace and defense applications. This ruggedized design exceeds stringent military specifications while delivering exceptional thermal performance in extreme environments.The Board Level Vertical Extrusion configuration withstands 15g vibration per MIL-STD-810H. Unlike commercial designs, this variant maintains thermal contact under combined thermal and mechanical stress.Engineered for power modules in radar and avionics systems, the solution manages {Power Dissipation @ Temperature Rise} at 50,000ft altitude. The thermal interface maintains performance across -55 C to +125 C operational range.The Solderable Feet attachment meets IPC-CC-830 requirements for high-reliability soldering. The design survives 1000+ thermal cycles from -55 C to +125 C without joint degradation.Angled Fins configuration delivers {Thermal Resistance @ Forced Air Flow} in reverse airflow conditions common in aircraft. The aerodynamic profile reduces pressure drop by 18% compared to straight fins.The 3.637" (92.38mm) dimension complies with ARINC 600 rack standards for avionics. The design includes provisions for conductive cooling to cold plates in liquid-cooled systems.With 3.626" (92.11mm) coverage, the solution meets SWaP-C constraints in military electronics. The lightweight construction reduces overall system weight by up to 30% compared to traditional designs.Optimized 1.142" (29.00mm) ensures performance in thin-atmosphere conditions. The fin geometry is validated through computational fluid dynamics at 0.2atm pressure.AavSHIELD 3C coated Aluminum provides EMI/RFI shielding exceeding MIL-STD-461G requirements. The material maintains thermal performance after salt fog exposure per MIL-STD-810G.Tin-plated finish ensures solderability after long-term storage per MIL-STD-2073-1. The surface treatment provides corrosion protection in naval environments.
Product Attributes
- Product Status: Active
- Type: Top Mount, Zipper Fin
- Package Cooled: Intel LGA2011 & LGA2066 CPU Cooler
- Attachment Method: Push Pin
- Shape: Square, Fins
- Length: 3.637" (92.38mm)
- Width: 3.626" (92.11mm)
- Diameter: -
- Fin Height: 1.142" (29.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Copper
- Material Finish: Nickel
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