B5740-103-F-C-2

The B5740-103-F-C-2 from Harwin Inc. delivers breakthrough performance in Rectangular Connectors - Free Hanging, Panel Mount for high-reliability computing applications. This precision-engineered interconnect solution is optimized for server backplanes, storage arrays, and network switches, offering exceptional signal integrity at data rates up to 56Gbps.As a Receptacle solution, it features a unique mezzanine design for vertical stacking of PCBs. The guided mating system ensures accurate alignment in high-density configurations with less than 0.2mm positional tolerance.The Female Socket design incorporates dual-beam geometry with independent contact points. This redundant configuration provides 60% better contact reliability than single-beam designs in vibration tests.Configurable up to 3 contacts, the connector supports various lane configurations for PCIe, SAS, and Ethernet protocols. The numbered keying system prevents incorrect card insertion.The 0.079" (2.00mm) fine-pitch arrangement enables 56G PAM4 signaling with less than -25dB worst-case crosstalk. The ground-signal-ground contact pattern provides optimal return path continuity.The 1 row staggered configuration reduces parallel resonance effects. This layout minimizes impedance discontinuities at high frequencies while maintaining mechanical stability.The Free Hanging (In-Line) version includes solder-tail options for both through-hole and surface-mount applications. The precision-molded alignment posts facilitate automated PCB assembly.The Locking Ramp mechanism provides both temporary and permanent retention options. The tool-less latch design enables quick card replacement during hot-swap operations.Featuring Crimp technology, the system maintains consistent impedance through the transition zone. The graduated strain relief prevents sharp bends within critical signal areas.Compatible with Discrete high-speed cables, the contacts preserve skew within 5ps/m across differential pairs. The controlled-impedance breakout region minimizes mode conversion.Supporting 24-28 AWG configurations, the power contacts deliver up to 3A per pin with less than 30 C temperature rise. The multi-finger design ensures parallel current paths for reduced resistance.The Gold plating combines low-friction surfaces with high wear resistance. The selective plating process applies different thicknesses to mating and termination areas.With 11.8µin (0.30µm) gold plating, the contacts exhibit less than 5m variation after 10,000 mating cycles. The nickel underplate prevents copper migration at high temperatures.The Black housing material incorporates laser-markable surfaces for permanent identification. The low-dielectric polymer maintains stable electrical properties across temperature variations.