BDN13-3CB/A01
CTS Thermal Management Products
BDN13-3CB/A01
CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.31"SQ
Reference Price (USD)
1+
$3.53000
500+
$3.4947
1000+
$3.4594
1500+
$3.4241
2000+
$3.3888
2500+
$3.3535
Exquisite packaging
Discount
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BDN13-3CB/A01
$3.53
Product details
The BDN13-3CB/A01 from CTS Thermal Management Products sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.The Pressure-Sensitive Adhesive system allows for tool-less installation with consistent bond strength (3-5N/cm ). The adhesive maintains performance across -20 C to +85 C operating range.Micro-Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in ultra-thin airflow channels. The 0.3mm fin pitch creates optimal boundary layer disruption for maximum heat transfer.The 1.310" (33.27mm) dimension fits within 5mm device profiles while providing sufficient thermal mass. The design prevents hot spot formation in corner-loaded scenarios.With 1.310" (33.27mm) coverage, the solution cools multiple heat sources simultaneously. Thermal imaging shows less than 4 C variation across the entire surface area.Precision 0.355" (9.02mm) of just 0.5mm enables integration in sub-8mm device profiles. The nanostructured surface enhances heat transfer coefficient by 15%.The 6.00°C/W @ 400 LFM performance is optimized for low-speed fans (<5 CFM). The design maintains acoustic levels below 25dBA in typical usage scenarios.The 16.10°C/W specification enables passive cooling in standby modes. The design maintains surface temperatures below 45 C in still air conditions.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.Black PVD coating ensures aesthetic consistency with consumer electronics while improving radiative cooling. The finish meets MIL-STD-810G abrasion resistance requirements.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Pin Fins
- Length: 1.310" (33.27mm)
- Width: 1.310" (33.27mm)
- Diameter: -
- Fin Height: 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 400 LFM
- Thermal Resistance @ Natural: 16.10°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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