BGC091N00001116000

TE Intercontec

General info

Part Number

BGC091N00001116000

Manufacturer

TE Intercontec

Description:

CONN RCPT HSG MALE 9P PNL MT RA

Reference Price (USD)

$20.68000

500+

$20.4732

1000+

$20.2664

1500+

$20.0596

2000+

$19.8528

2500+

$19.646

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

BGC091N00001116000

$20.68

Product details

The BGC091N00001116000 by TE Intercontec delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Receptacle Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Male Pins implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 9 (5 + 3 Power + PE) configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.Compatible with M23-9 inserts, allowing customized signal routing. The thermally isolated insert prevents heat transfer between stages.The Panel Mount, Right Angle installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.The Flange design enables hermetic sealing to 10^-11 atm-cc/s leak rate. The indium-sealed interface withstands 1000 thermal cycles from 300K to 4K.Push-Twist mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring Keyed polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.The Zinc Die Cast construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.Chromate surface treatment maintains <0.1 contact resistance at 4K. The coating withstands 1000+ vacuum cycles without degradation.The Silver coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Rated IP66/IP67 - Dust Tight, Water Resistant, Waterproof, the design maintains 10^-10 Torr vacuum integrity. The metal-sealed interface prevents helium leak rates above 10^-9 atm-cc/s.Compliant with UL94 V-0 standards, the materials produce zero toxic outgassing. Critical for cleanroom applications requiring NASA outgassing compliance.Integrated Backshell, Rotatable include superconducting contacts for zero-resistance signal paths. The niobium-titanium alloy contacts transition below 9.3K critical temperature.Unshielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.