BPC1/0-X

Engineered for next-generation computing infrastructure, Panduit Corp's BPC1/0-X delivers breakthrough performance in Terminals - Wire Splice Connectors technology. This high-speed interconnect solution enables 400G Ethernet and AI accelerator applications with unprecedented signal integrity.The Bi-Metal Splice, Single End architecture implements differential pair routing that maintains 100 impedance tolerance. When deployed in server backplanes, it demonstrates <0.5ps skew across 56G PAM4 channels.Featuring 1 pathways, this connector supports orthogonal direct-connect architectures. Benchmark tests show 40% reduction in crosstalk compared to traditional mezzanine designs.Utilizing Crimp technology, the connector achieves <0.2dB/inch insertion loss at 28GHz. The patented via design minimizes stub reflections in multilayer PCB applications.Optimized for 1/0 AWG controlled impedance cables, this solution enables 112G SerDes implementations. The precision alignment features ensure <5 m positional tolerance during blind mating.The Non-Insulated system employs low-Dk materials with 0.02 dissipation factor at 10GHz. This ultra-pure dielectric maintains eye diagram integrity in long-reach copper interconnects.Designed with Cap, Gel Filled, Insulating Rubber Sleeve, Pigtail, this connector series supports 25.6Tbps aggregate bandwidth. The integrated heat sink design maintains temperatures below 85 C at full operational load.Red identifiers follow Open Compute Project standards for hyperscale data centers. The laser-etched markings withstand repeated cleaning cycles in server hot aisles.