BSP-226769-01
Samtec Inc.
Product details
The BSP-226769-01 from Samtec Inc. represents a cutting-edge solution in Backplane Connectors - Specialized, engineered for high-density backplane applications requiring exceptional signal integrity. This advanced connector system combines robust construction with precision engineering to deliver reliable performance in mission-critical environments.Designed specifically for Daughtercard applications, this product series delivers proven performance in high-speed digital systems up to 56Gbps NRZ.With Receptacle, Female Sockets and Blade Sockets configuration, this component ensures optimal mating compatibility while maintaining superior electrical characteristics. The hermaphroditic contact design enhances assembly flexibility in complex systems.Featuring XCede® technology, the connector achieves industry-leading contact reliability, particularly beneficial for high-vibration environments found in industrial automation equipment.With 0.071" (1.80mm) centerline spacing, the design achieves optimal balance between high-density packaging and manufacturability requirements.The Through Hole, Right Angle mounting option facilitates both standard and high-reliability PCB attachment methods, with proven performance in through-hole reflow processes.
Product Attributes
- Product Status: Active
- Connector Usage: Daughtercard
- Connector Type: Receptacle, Female Sockets and Blade Sockets
- Connector Style: XCede®
- Number of Positions: -
- Number of Positions Loaded: -
- Pitch: 0.071" (1.80mm)
- Number of Rows: -
- Number of Columns: -
- Mounting Type: Through Hole, Right Angle
- Termination: -
- Contact Layout, Typical: -
- Features: -
- Contact Finish: -
- Contact Finish Thickness: -
- Color: -