BTE-100-06-L-D-A
Samtec Inc.
BTE-100-06-L-D-A
Samtec Inc.
CONN HDR 200POS SMD GOLD
Reference Price (USD)
1+
$25.42667
500+
$25.1724033
1000+
$24.9181366
1500+
$24.6638699
2000+
$24.4096032
2500+
$24.1553365
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Product details
Samtec Inc.'s BTE-100-06-L-D-A delivers breakthrough performance for Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) in quantum computing applications. This cryogenic-rated connector maintains signal integrity at 4K temperatures while providing ultra-low thermal conductivity for superconducting circuits.The Header, Outer Shroud Contacts configuration features special materials that minimize heat leak in dilution refrigerators. Unlike standard connectors, this design maintains stable impedance from room temperature to near absolute zero.Available in 200 configurations, the connector supports both qubit control lines and readout channels. The arrangement minimizes crosstalk between sensitive microwave signals.The 0.031" (0.80mm) spacing has been optimized for superconducting chip integration. The non-magnetic materials prevent flux trapping in quantum interference devices.The 2 row architecture provides isolated paths for DC bias and RF signals. This configuration has been validated for 50 impedance control at millikelvin temperatures.Designed for Surface Mount installation in cryogenic systems, the connector withstands repeated thermal cycling. The materials exhibit matched thermal contraction coefficients with common quantum computing substrates.Critical Board Guide include ultra-high vacuum compatibility and non-outgassing materials. These properties are essential for maintaining clean environments in quantum processors.The Gold formulation maintains superconductivity at interface points. Special surface treatments prevent oxide formation in oxygen-free environments.With 10.0µin (0.25µm) precision, the contacts achieve consistent thermal and electrical performance. This control is vital for maintaining qubit coherence times.The 22.02mm options accommodate various quantum computing packaging approaches. The design minimizes vibrational coupling between stages.The 0.837" (21.26mm) profile has been optimized for integration with quantum chip carriers. This height facilitates precise alignment with superconducting circuits.
Product Attributes
- Product Status: Active
- Connector Type: Header, Outer Shroud Contacts
- Number of Positions: 200
- Pitch: 0.031" (0.80mm)
- Number of Rows: 2
- Mounting Type: Surface Mount
- Features: Board Guide
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Mated Stacking Heights: 22.02mm
- Height Above Board: 0.837" (21.26mm)