C3200-6142
Honeywell Sensing and Productivity Solutions
Product details
Optimized for next-generation computing systems, C3200-6142 from Honeywell Sensing and Productivity Solutions delivers breakthrough thermal management for Heat Tape, Heat Blankets and Heaters applications. Its microchannel heat transfer technology provides superior cooling for high-density server racks and AI accelerator modules.The liquid-cooled Flexible Heater, Foil design achieves 3x greater thermal conductivity than conventional air-cooled solutions for data center applications.The modular Rectangular configuration allows for scalable cooling across multi-processor architectures.The extended 3.000" (76.20mm) version supports full-length GPU accelerator cards in deep learning systems.High-aspect ratio 2.000" (50.80mm) design maximizes contact area with heat-generating components.The tool-less No Pressure Sensitive Adhesive (PSA) enables quick servicing in high-availability data centers.High-current Wire Leads handles up to 30A per phase in power-hungry computing applications.Custom 2' (0.61m) options accommodate various rack mounting configurations.The Silicone maintains dielectric properties even in high-humidity server environments.The 22 AWG specification ensures minimal voltage drop in high-power compute racks.Certified to CSA, UL standards for data center safety and efficiency.
Product Attributes
- Product Status: Obsolete
- Type: Flexible Heater, Foil
- Temperature Rating: -
- Watt Density @ 12V: -
- Power (Watts): -
- Voltage: -
- Resistance: -
- Shape: Rectangular
- Length: 3.000" (76.20mm)
- Width: 2.000" (50.80mm)
- Diameter: -
- Thickness: -
- Material: -
- Attachment Method: No Pressure Sensitive Adhesive (PSA)
- Termination: Wire Leads
- Length - Lead Wire: 2' (0.61m)
- Material - Insulation: Silicone
- Wire Gauge: 22 AWG
- Color: -
- Approval Agency: CSA, UL
- Features: -