CP074933-238
CUI Devices
Product details
The CP074933-238 from CUI Devices delivers breakthrough performance in Thermal - Thermoelectric, Peltier Modules for consumer electronics. Engineered for high-volume production, this Peltier module combines cost-effectiveness with reliable thermal management for gaming consoles, high-performance PCs, and premium audio equipment.<p>The consumer-optimized Rectangular - 4.90mm L x 3.30mm W footprint allows for direct integration with standard heat sink designs while minimizing BOM costs.</p><p>With 0.6W @ 27°C cooling capacity, this module provides superior thermal performance for overclocked processors and high-TDP components.</p><p>The 70°C @ 27°C temperature differential enables effective cooling of heat-intensive components in compact consumer devices.</p><p>At just 2.38mm tall, the module fits within the slim profiles demanded by modern consumer electronics designs.</p><p>Designed for mainstream power supplies, the module operates efficiently at 0.7 A while maintaining quiet operation.</p><p>The 1.3 V voltage rating ensures compatibility with both desktop and laptop power delivery systems.</p><p>Optimized 1.43 Ohms values contribute to energy efficiency, reducing operational costs for end users.</p><p>Rated for 150°C operation, the module performs reliably in home and office environments.</p><p>Consumer-friendly Lead Wires, Non-Sealed include vibration damping and EMI reduction for improved user experience.</p>
Product Attributes
- Product Status: Active
- Size / Dimension: Rectangular - 4.90mm L x 3.30mm W
- Qmax @ Th: 0.6W @ 27°C
- Delta Tmax @ Th: 70°C @ 27°C
- Height: 2.38mm
- Number of Stages: -
- Current - Max: 0.7 A
- Voltage - Max: 1.3 V
- Resistance: 1.43 Ohms
- Operating Temperature: 150°C
- Features: Lead Wires, Non-Sealed