CP074965-238P
CUI Devices
Product details
CUI Devices's CP074965-238P sets new standards for precision cooling in Thermal - Thermoelectric, Peltier Modules applications. Developed for semiconductor test equipment, this Peltier module delivers milli-Kelvin temperature stability and rapid thermal cycling capabilities. Its ultra-clean design prevents contamination in sensitive wafer probing and IC testing environments.<p>The precision-machined Rectangular - 4.90mm L x 6.50mm W surfaces ensure perfect thermal interface with probe card assemblies while maintaining strict flatness tolerances.</p><p>With 0.9W @ 27°C heat pumping capacity, the module maintains exacting temperature control for advanced semiconductor characterization.</p><p>The 70°C @ 27°C maximum temperature differential enables comprehensive device testing across military temperature ranges.</p><p>The 2.77mm vertical dimension has been minimized to reduce thermal mass while maintaining structural integrity in high-cycle test applications.</p><p>Precision current regulation up to 0.7 A enables sub-degree temperature control for sensitive IC characterization.</p><p>The 2.1 V voltage rating accommodates both benchtop and automated test equipment power requirements.</p><p>Ultra-consistent 2.35 Ohms across production units ensures repeatable test conditions for statistical process control.</p><p>Certified for 150°C operation, the module performs reliably in burn-in and accelerated life testing applications.</p><p>The Lead Wires, Non-Sealed design prevents particulate generation and outgassing in cleanroom test environments.</p>
Product Attributes
- Product Status: Active
- Size / Dimension: Rectangular - 4.90mm L x 6.50mm W
- Qmax @ Th: 0.9W @ 27°C
- Delta Tmax @ Th: 70°C @ 27°C
- Height: 2.77mm
- Number of Stages: -
- Current - Max: 0.7 A
- Voltage - Max: 2.1 V
- Resistance: 2.35 Ohms
- Operating Temperature: 150°C
- Features: Lead Wires, Non-Sealed