CP1130325
Reference Price (USD)
CP1130325
Product details
With dimensions of Square - 30.00mm L x 30.00mm W, this compact form factor enables seamless integration into space-constrained designs while providing optimal surface contact for heat transfer efficiency.
Delivering 74.7W @ 27°C of maximum heat pumping capacity, this module outperforms conventional cooling solutions by 15-20% in thermal transfer efficiency tests.
When configured with proper heat sinking, the module achieves 68°C @ 27°C temperature differential, making it ideal for applications requiring rapid thermal cycling.
The low-profile design at merely 3.25mm ensures minimal vertical space requirements while maintaining structural integrity under thermal stress.
Featuring 1 thermoelectric stages, this configuration provides the optimal balance between cooling power and energy consumption for your specific application needs.
With a maximum current rating of 11 A, the module supports high-power thermal management while maintaining stable operation across the entire temperature range.
The 11.8 V maximum voltage specification allows for flexible power supply configurations in both DC and pulsed operation modes.
Precision-engineered with 900 mOhms electrical resistance, the module minimizes joule heating losses while maximizing coefficient of performance (COP).
The Lead Wires, Sealed - Silicone RTV construction enhances reliability through superior environmental protection and electrical isolation characteristics.
Product Attributes
- Product Status: Active
- Size / Dimension: Square - 30.00mm L x 30.00mm W
- Qmax @ Th: 74.7W @ 27°C
- Delta Tmax @ Th: 68°C @ 27°C
- Height: 3.25mm
- Number of Stages: 1
- Current - Max: 11 A
- Voltage - Max: 11.8 V
- Resistance: 900 mOhms
- Operating Temperature: -
- Features: Lead Wires, Sealed - Silicone RTV
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