CP4055485
CUI Devices
Product details
CUI Devices's CP4055485 sets new standards for precision cooling in Thermal - Thermoelectric, Peltier Modules applications. Developed for semiconductor test equipment, this Peltier module delivers milli-Kelvin temperature stability and rapid thermal cycling capabilities. Its ultra-clean design prevents contamination in sensitive wafer probing and IC testing environments.<p>The precision-machined Square - 55.00mm L x 55.00mm W surfaces ensure perfect thermal interface with probe card assemblies while maintaining strict flatness tolerances.</p><p>With 63.0W @ 27°C heat pumping capacity, the module maintains exacting temperature control for advanced semiconductor characterization.</p><p>The 70°C @ 27°C maximum temperature differential enables comprehensive device testing across military temperature ranges.</p><p>The 4.85mm vertical dimension has been minimized to reduce thermal mass while maintaining structural integrity in high-cycle test applications.</p><p>The 1-stage architecture provides the gradual temperature transitions required for reliable semiconductor reliability testing.</p><p>Precision current regulation up to 4 A enables sub-degree temperature control for sensitive IC characterization.</p><p>The 29.8 V voltage rating accommodates both benchtop and automated test equipment power requirements.</p><p>Ultra-consistent 5.97 Ohms across production units ensures repeatable test conditions for statistical process control.</p><p>The Lead Wires, Sealed - Silicone RTV design prevents particulate generation and outgassing in cleanroom test environments.</p>
Product Attributes
- Product Status: Active
- Size / Dimension: Square - 55.00mm L x 55.00mm W
- Qmax @ Th: 63.0W @ 27°C
- Delta Tmax @ Th: 70°C @ 27°C
- Height: 4.85mm
- Number of Stages: 1
- Current - Max: 4 A
- Voltage - Max: 29.8 V
- Resistance: 5.97 Ohms
- Operating Temperature: -
- Features: Lead Wires, Sealed - Silicone RTV