CYUSB3013-BZXC

Infineon Technologies's CYUSB3013-BZXC redefines performance standards in Embedded - Microcontrollers - Application Specific, specifically developed for next-generation IoT edge nodes. This application-specific microcontroller combines ultra-low power consumption with robust security features, making it ideal for distributed sensor networks and smart city infrastructure.Designed for SuperSpeed USB Peripheral Controller implementations, the microcontroller's hardware security modules exceed FIPS-140-2 requirements. Its tamper-resistant design includes active shield technology for physical attack prevention.The ARM9® architecture incorporates branch prediction and speculative execution for improved DSP performance. Cryptographic extensions accelerate AES-256 operations by 8x compared to software implementations.Supporting External Program Memory configurations, the memory controller implements error detection and correction. The dual-bank flash architecture enables secure over-the-air updates without service interruption.As a member of the CYUSB family, this device shares common security architecture with higher-end models. The consistent threat detection framework simplifies certification efforts.The 512K x 8 memory subsystem implements parity protection for all SRAM blocks. The memory controller supports both little-endian and big-endian data formats for protocol flexibility.With GPIF, I²C, I²S, SPI, UART, USB connectivity options, the device supports deterministic industrial Ethernet protocols. Each interface includes integrated magnetics for simplified PoE (Power over Ethernet) implementations.The 60 programmable GPIOs feature Schmitt trigger inputs for noise immunity. Configurable open-drain outputs support direct LED driving without external transistors.The 1.15V ~ 1.25V power architecture implements adaptive body biasing for leakage current reduction. The integrated buck converter achieves 92% power efficiency across load variations.Certified for 0°C ~ 70°C operation, the device utilizes copper pillar bump technology for enhanced thermal conductivity. The package design minimizes thermal resistance to PCB substrates.The Surface Mount option supports reflow profiles compatible with lead-free SAC305 solder. Package warpage is controlled to <0.05mm for high-yield assembly processes.Available in 121-TFBGA format, the package incorporates stress-relief features for improved board-level reliability. Moisture sensitivity meets JEDEC J-STD-020D Level 3 standards.Supplied in 121-FBGA (10x10) configuration, each unit includes unique cryptographic identifiers for supply chain authentication. Tape-and-reel packaging supports automated pick-and-place assembly.