CYUSB3064-BZXI

The CYUSB3064-BZXI by Infineon Technologies sets new benchmarks in Embedded - Microcontrollers - Application Specific, optimized for automotive electronics and rugged industrial applications. This application-specific microcontroller delivers military-grade reliability with automotive-qualified components, ensuring operation in the most demanding environments.Tailored for USB Host/Peripheral Controller deployments, the microcontroller includes ASIL-D compliant safety monitors. The dual-core lockstep architecture provides continuous fault detection for functional safety applications.Built around ARM9® technology, the CPU features cache coherency protocols for multi-core synchronization. The superscalar architecture achieves 2.5 DMIPS/MHz performance for real-time control algorithms.The External Program Memory organization supports secure boot with cryptographic signature verification. Memory partitions enforce strict access privileges for enhanced software security.As part of the CYUSB family, this microcontroller shares common development tools with other members. The consistent register map simplifies software porting between variants.The 512K x 8 memory implements ECC protection for single-error correction and double-error detection. The memory controller supports byte-addressable access for efficient data manipulation.Featuring GPIF, I²C, I²S, SPI, UART, USB connectivity, the device includes CAN-FD controllers with 5Mbps capability. Each communication peripheral implements galvanic isolation for ground potential difference tolerance.With 12 configurable ports, the GPIO subsystem supports 8mA drive strength per pin. Programmable pull-up/pull-down resistors eliminate external components in typical designs.Operating from 1.15V ~ 1.25V inputs, the power management unit includes load-dump protection up to 40V. The integrated voltage supervisors ensure proper brown-out recovery sequences.Rated for -40°C ~ 85°C operation, the device employs silicon-on-sapphire technology for improved thermal characteristics. The package design minimizes thermal resistance to the PCB.The Surface Mount configuration supports conformal coating for humidity resistance. Solder joints are designed for thermal cycling reliability exceeding 1000 cycles (-40 C to +125 C).The 121-LFBGA option features wettable flank plating for automated optical inspection. Package dimensions comply with automotive PCB spacing requirements.Available in 121-BGA (10x10) format, each unit undergoes extended life testing. The manufacturing flow includes 100% electrical testing at temperature extremes.