D38999/20FG11PA-LC

Conesys

General info

Part Number

D38999/20FG11PA-LC

Manufacturer

Conesys

Description:

AE3 11C 11#12 PIN RECP

Datasheet:

D38999/20FG11PA-LC PDF

Reference Price (USD)

$48.89000

500+

$48.4011

1000+

$47.9122

1500+

$47.4233

2000+

$46.9344

2500+

$46.4455

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

D38999/20FG11PA-LC

$48.89

Product details

The D38999/20FG11PA-LC by Conesys delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Receptacle Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Male Pins implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 11 configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.Compatible with 21-11 inserts, allowing customized signal routing. The thermally isolated insert prevents heat transfer between stages.Conforming to G specifications, the housing interfaces with standard cryogenic feedthroughs. The radiation-resistant design withstands 100kGy ionizing radiation.Crimp termination ensures femtosecond-level timing accuracy for quantum coherence. The superconducting contacts maintain <0.01 phase stability.Designed for 12 contacts, the current capacity reaches 100A in superconducting state. The optimized geometry minimizes eddy current losses.The Panel Mount installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.The Flange design enables hermetic sealing to 10^-11 atm-cc/s leak rate. The indium-sealed interface withstands 1000 thermal cycles from 300K to 4K.Threaded mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring A polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.The Aluminum Alloy construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.Electroless Nickel surface treatment maintains <0.1 contact resistance at 4K. The coating withstands 1000+ vacuum cycles without degradation.The Silver coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Rated Environment Resistant, the design maintains 10^-10 Torr vacuum integrity. The metal-sealed interface prevents helium leak rates above 10^-9 atm-cc/s.Shielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.