D6417709SHX200BV
Renesas Electronics America Inc
D6417709SHX200BV
Renesas Electronics America Inc
IC MCU 32BIT ROMLESS 208QFP
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Product details
Designed for industrial IoT applications, the D6417709SHX200BV by Renesas Electronics America Inc redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The SH-3 core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 32-Bit Single-Core architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 200MHz with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.The EBI/EMI, FIFO, IrDA, SCI, SmartCard interfaces incorporate galvanic isolation support, enabling direct connection to industrial fieldbus networks without external isolation components.DMA, POR, WDT include advanced security features like cryptographic accelerators and true random number generators, protecting industrial equipment from cyber threats.With 96 programmable as either digital or analog interfaces, the device can directly interface with diverse industrial sensors including 4-20mA loops.The ROMless implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.16K x 8 of retention RAM maintains context during deep sleep modes, enabling instant wake-up response to critical process events.The 1.85V ~ 2.15V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.Precision A/D 8x10b; D/A 2x8b achieve 16-bit effective resolution through oversampling, enabling direct connection to RTD temperature sensors without external amplifiers.The Internal design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for -20°C ~ 75°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.
Product Attributes
- Product Status: Active
- Core Processor: SH-3
- Core Size: 32-Bit Single-Core
- Speed: 200MHz
- Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard
- Peripherals: DMA, POR, WDT
- Number of I/O: 96
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 16K x 8
- Voltage - Supply (Vcc/Vdd): 1.85V ~ 2.15V
- Data Converters: A/D 8x10b; D/A 2x8b
- Oscillator Type: Internal
- Operating Temperature: -20°C ~ 75°C (TA)
- Mounting Type: -
- Package / Case: -
- Supplier Device Package: -
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