DF51K-30SC(800)

The DF51K-30SC(800) from Hirose Electric Co Ltd delivers breakthrough performance in Rectangular Connectors - Contacts, specifically tailored for 5G infrastructure applications. Its innovative design addresses the unique challenges of millimeter-wave signal transmission.The Stamped manufacturing process guarantees consistent performance across all contacts in high-density arrays. This precision is mandatory for phased array antenna systems requiring uniform signal propagation.Featuring Socket architecture, the connector maintains impedance control up to 40GHz, essential for 5G RF front-end modules. The contact geometry minimizes signal reflection while maximizing bandwidth utilization.The Crimp system provides ultra-low insertion loss, critical for maintaining signal-to-noise ratio in sensitive receiver circuits. This termination style has been optimized for high-frequency performance.Compatible with 30 AWG wiring, the contacts ensure proper skin effect management at microwave frequencies. The precision-engineered contact points minimize signal attenuation in high-speed data links.The Tin plating was selected for its exceptional high-frequency characteristics, providing stable contact resistance across wide temperature fluctuations. This finish outperforms standard options in multipaction testing.With 39.4µin (1.00µm) deposition, the contacts achieve optimal RF performance while maintaining mechanical durability. This specification balances electrical requirements with wear resistance.