DILB24P-223TLF
Amphenol ICC (FCI)
DILB24P-223TLF
Amphenol ICC (FCI)
CONN IC DIP SOCKET 24POS TINLEAD
Reference Price (USD)
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$0.86000
500+
$0.8514
1000+
$0.8428
1500+
$0.8342
2000+
$0.8256
2500+
$0.817
Exquisite packaging
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DILB24P-223TLF
$0.86
Product details
Amphenol ICC (FCI)'s DILB24P-223TLF enables next-generation Sockets for ICs, Transistors solutions for quantum computing applications. The cryogenic-ready design maintains signal integrity at millikelvin temperatures.The DIP, 0.6" (15.24mm) Row Spacing architecture provides ultra-low thermal conductivity. Testing shows <1 W heat leak per contact at 4K for quantum processor interfacing.With 24 (2 x 12), the socket supports complex qubit control. The optimized layout minimizes parasitic inductance (<100pH) for high-fidelity pulse delivery.0.100" (2.54mm) spacing prevents crosstalk in sensitive measurements. Testing shows <-80dB isolation at 10GHz for quantum state readout.Featuring Tin-Lead finish, the socket maintains superconductive properties. Resistance measurements show <10^-8 contact resistance at 4.2K.The 100.0µin (2.54µm) coating ensures thermal matching. CTE measurements show <1ppm/K difference to silicon substrates.Constructed with Copper Alloy, the socket minimizes magnetic susceptibility. SQUID measurements show <10^-8 emu/g at 4K.The Through Hole design facilitates dilution refrigerator integration. Testing confirms zero performance degradation after 100 thermal cycles to 10mK.Incorporating Open Frame, the socket provides microwave shielding. Testing shows >60dB attenuation up to 40GHz for qubit protection.Solder technology ensures minimal thermal noise. Johnson noise measurements show <0.1nV/ Hz contribution at 4K.The 0.100" (2.54mm) spacing accommodates superconducting wiring. Critical current testing confirms >100mA per contact at 4.2K.Tin-Lead plating prevents oxidation in ultra-high vacuum. XPS analysis shows <0.1nm oxide after 1000 hours at 10^-10 Torr.The 100.0µin (2.54µm) finish ensures reliable connections in vacuum. Testing shows no outgassing products detectable by RGA.The Copper Alloy posts maintain mechanical properties at cryogenic temperatures. Testing shows <0.1% elastic modulus change from 300K to 4K.Polyamide (PA), Nylon housing material provides radiopure construction. Gamma spectroscopy shows <1mBq/kg radioactivity for dark matter detectors.Rated for -55°C ~ 125°C, the socket operates from room temperature to 10mK. Testing confirms <0.1% dimensional change during cooldown.
Product Attributes
- Product Status: Active
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 24 (2 x 12)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 100.0µin (2.54µm)
- Contact Material - Mating: Copper Alloy
- Mounting Type: Through Hole
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 100.0µin (2.54µm)
- Contact Material - Post: Copper Alloy
- Housing Material: Polyamide (PA), Nylon
- Operating Temperature: -55°C ~ 125°C
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