DIN-150RPC-S110-TG30
3M
DIN-150RPC-S110-TG30
3M
CONN DIN HDR 150POS PCB GOLD
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DIN-150RPC-S110-TG30
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Product details
The DIN-150RPC-S110-TG30 by 3M revolutionizes Backplane Connectors - DIN 41612 technology for quantum computing applications. This cryogenic-rated connector maintains signal integrity at ultra-low temperatures.Available in Header, Male Pins configurations, the connector operates reliably in 4K cryogenic environments.With 150 contact positions, the design supports complex qubit control and readout systems.When fully loaded with All positions, the connector maintains nanovolt-level signal stability.The 0.100" (2.54mm) pitch configuration minimizes thermal conductivity while ensuring signal isolation.Featuring 3 row arrangements, the connector optimizes thermal management in cryostats.The R style interface incorporates ultra-high vacuum compatibility for quantum computing systems.Through Hole mounting provides precise alignment for superconducting circuit interconnections.Utilizing Solder technology, the connector achieves negligible thermal emf for sensitive measurements.The Gold surface treatment prevents cold welding in cryogenic cycling conditions.With 30.0µin (0.76µm) plating thickness, the contacts maintain stable characteristics across temperature extremes.
Product Attributes
- Product Status: Obsolete
- Connector Type: Header, Male Pins
- Number of Positions: 150
- Number of Positions Loaded: All
- Pitch: 0.100" (2.54mm)
- Number of Rows: 3
- Style: R
- Level, Class: -
- Mounting Type: Through Hole
- Termination: Solder
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
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