DK1017-2.5
Birk Manufacturing
Product details
Optimized for next-generation computing systems, DK1017-2.5 from Birk Manufacturing delivers breakthrough thermal management for Heat Tape, Heat Blankets and Heaters applications. Its microchannel heat transfer technology provides superior cooling for high-density server racks and AI accelerator modules.The liquid-cooled Flexible Heater, Foil design achieves 3x greater thermal conductivity than conventional air-cooled solutions for data center applications.Maintaining 302°F (150°C) stability, this solution prevents thermal throttling in overclocked processor environments.The modular Rectangular configuration allows for scalable cooling across multi-processor architectures.The extended 4.000" (101.60mm) version supports full-length GPU accelerator cards in deep learning systems.High-aspect ratio 2.000" (50.80mm) design maximizes contact area with heat-generating components.The Polyimide construction provides exceptional corrosion resistance in liquid cooling loops.The tool-less Pressure Sensitive Adhesive (PSA) enables quick servicing in high-availability data centers.High-current Wire Leads handles up to 30A per phase in power-hungry computing applications.Custom 18.000" (457.20mm) options accommodate various rack mounting configurations.The 26 AWG specification ensures minimal voltage drop in high-power compute racks.The Red coding simplifies maintenance in multi-node server installations.
Product Attributes
- Product Status: Active
- Type: Flexible Heater, Foil
- Temperature Rating: 302°F (150°C)
- Watt Density @ 12V: -
- Power (Watts): -
- Voltage: -
- Resistance: -
- Shape: Rectangular
- Length: 4.000" (101.60mm)
- Width: 2.000" (50.80mm)
- Diameter: -
- Thickness: -
- Material: Polyimide
- Attachment Method: Pressure Sensitive Adhesive (PSA)
- Termination: Wire Leads
- Length - Lead Wire: 18.000" (457.20mm)
- Material - Insulation: -
- Wire Gauge: 26 AWG
- Color: Red
- Approval Agency: -
- Features: -