DLP-HS-FPGA3
DLP Design Inc.
DLP-HS-FPGA3
DLP Design Inc.
IC MODULE SPARTAN-3A 66MHZ 32MB
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Product details
The DLP-HS-FPGA3 from DLP Design Inc. delivers military-grade reliability for the Embedded - Microcontroller, Microprocessor, FPGA Modules sector, specifically developed for aerospace and defense applications. Its radiation-hardened design and secure architecture meet the most demanding requirements for avionics and satellite systems.The FPGA, USB Core configuration incorporates triple modular redundancy for fault-tolerant space applications. This architecture provides graceful degradation capabilities essential for long-duration satellite missions.At its core, the Spartan-3A, XC3S1400A features SEU-resistant logic and hardened registers. Its deterministic execution pipeline has been qualified for radiation environments up to 50krad, making it suitable for LEO satellite constellations.The radiation-tolerant FT2232H accelerates cryptographic operations while maintaining TEMPEST compliance. This dedicated security processor enables real-time encryption of classified communications in battlefield systems.With a clock speed of 66MHz, the processor balances performance with power efficiency in space-constrained payloads. The radiation-hardened PLL maintains stable clock generation even in high-ionization environments.32MB of SECDED-protected RAM ensures data integrity in high-radiation orbits. The memory subsystem's error detection and correction capabilities exceed MIL-STD-883 requirements for space applications.The USB - B, Pin Header interface meets MIL-DTL-38999 specifications for harsh environments. Its hermetic sealing and redundant contact design ensure reliable operation in vibration-intensive fighter jet avionics.The compact 3" x 1.2" (76.2mm x 30.5mm) form factor enables integration into CubeSat payloads. Despite its small size, the package provides adequate shielding against cosmic ray-induced single-event effects.Rated for 0°C ~ 70°C, the module operates reliably in the thermal extremes of space. The qualification process includes thermal vacuum cycling to simulate orbital conditions.
Product Attributes
- Product Status: Obsolete
- Module/Board Type: FPGA, USB Core
- Core Processor: Spartan-3A, XC3S1400A
- Co-Processor: FT2232H
- Speed: 66MHz
- Flash Size: -
- RAM Size: 32MB
- Connector Type: USB - B, Pin Header
- Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
- Operating Temperature: 0°C ~ 70°C