DM355SCZCE270

The DM355SCZCE270 from Texas Instruments establishes new benchmarks in Embedded - DSP (Digital Signal Processors) technology for professional audio equipment. This high-fidelity DSP solution delivers studio-grade signal processing for mixing consoles, effects processors, and digital audio workstations.Featuring Digital Media System-on-Chip (DMSoC) architecture, the processor combines 64-bit floating-point precision with ultra-low-latency audio processing. Its SHARC+ cores deliver the computational headroom needed for complex plugin chains and virtual instruments.The comprehensive ASP, I²C, SPI, UART, USB package includes high-speed audio interfaces like TDM, I2S, and S/PDIF. The low-jitter digital audio transport maintains pristine signal integrity throughout the signal chain.Operating at 270MHz, the DSP achieves the timing precision required for sample-accurate audio processing. The ultra-low-phase-noise clock distribution preserves audio quality in professional studio environments.With ROM (8kB) capacity, the device stores extensive preset libraries and impulse responses. The wear-leveling algorithm extends flash memory lifespan in touring equipment.The 56kB configuration provides ample space for multi-channel delay lines and reverb tanks. The low-latency memory architecture enables real-time monitoring with near-zero delay.Supporting 1.8V, 3.3V standards, the audio interfaces maintain compatibility with professional gear. The balanced line drivers incorporate electromagnetic interference rejection for clean audio transmission.The 1.30V domain implements analog-style voltage regulation for noise-sensitive audio applications. The power supply rejection ratio exceeds 100dB at audio frequencies.Rated for 0°C ~ 85°C (TC), the device performs reliably in touring rackmount equipment. The thermal design accounts for limited ventilation in stacked configurations.The Surface Mount option facilitates serviceability in modular audio systems. The package design enables hot-swapping in redundant broadcast setups.Housed in 337-LFBGA, the processor features RF-shielded construction for studio environments. The package material minimizes microphonic effects in sensitive microphone preamps.Available in 337-BGA (13x13), this audio DSP meets mechanical specifications for road-worthy equipment. The packaging includes vibration-damping features for touring applications.