DRA829VMTGBALFR
Texas Instruments
Product details
Engineered for next-generation consumer electronics, Texas Instruments's DRA829VMTGBALFR revolutionizes Embedded - System On Chip (SoC) performance in smart home devices. This advanced SoC combines powerful processing with intuitive user interfaces, making DRA829VMTGBALFR ideal for voice-controlled assistants where audio signal processing and low-latency response are critical.The multi-core DSP, MCU, MPU architecture enables simultaneous voice recognition, natural language processing, and wireless communication tasks.Featuring the ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x, the device delivers the computational power needed for real-time audio beamforming and noise cancellation algorithms.With 1.5MB of low-latency RAM, the processor ensures smooth performance during complex voice interaction scenarios.Consumer-focused DMA, PWM, WDT include high-fidelity audio interfaces and touch controllers for seamless user experiences.The comprehensive MCAN, MMC/SDSD/IOI²C, SPI, UART, USB suite supports all major smart home protocols while maintaining robust wireless performance.Operating at 2GHz, 1GHz, 1.35GHz, 1GHz, the processor meets the real-time requirements of always-listening voice interfaces.Rated for -40°C ~ 105°C (TJ), the component maintains reliable operation in various home environments.The 827-BFBGA, FCBGA package enables sleek, compact designs without compromising thermal performance.Available in 827-FCBGA (24x24), the device supports high-volume consumer electronics manufacturing.
Product Attributes
- Product Status: Active
- Architecture: DSP, MCU, MPU
- Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
- Flash Size: -
- RAM Size: 1.5MB
- Peripherals: DMA, PWM, WDT
- Connectivity: MCAN, MMC/SDSD/IOI²C, SPI, UART, USB
- Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Package / Case: 827-BFBGA, FCBGA
- Supplier Device Package: 827-FCBGA (24x24)