DRA829VMTGBALFRQ1
Texas Instruments
DRA829VMTGBALFRQ1
Texas Instruments
DUAL ARM CORTEX-A72, QUAD CORTEX
Reference Price (USD)
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$87.12000
500+
$86.2488
1000+
$85.3776
1500+
$84.5064
2000+
$83.6352
2500+
$82.764
Exquisite packaging
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DRA829VMTGBALFRQ1
$87.12
Product details
Texas Instruments's DRA829VMTGBALFRQ1 revolutionizes Embedded - System On Chip (SoC) technology for aerospace and defense applications. Optimized for extreme environments, this radiation-hardened SoC combines fault-tolerant design with military-grade reliability, making DRA829VMTGBALFRQ1 the preferred choice for satellite systems where component longevity and single-event upset immunity are critical.The triple-redundant DSP, MCU, MPU architecture provides SEU mitigation through continuous voting logic, ensuring uninterrupted operation in high-radiation orbits.The ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x core delivers space-qualified processing power with built-in error detection and correction mechanisms for mission-critical computations.With 1.5MB of scrubbed RAM, the processor maintains data integrity even during solar flare events and other space radiation phenomena.Space-grade DMA, PWM, WDT include MIL-STD-1553 interfaces and spacewire controllers essential for spacecraft avionics systems.The I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB suite supports both traditional aerospace databuses and modern high-speed interconnects required for next-generation satellite payloads.Operating at 2GHz, 1GHz, 1.35GHz, 1GHz, the processor meets the real-time requirements of attitude control systems while staying within strict power budgets.Qualified for -40°C ~ 125°C (TJ), the component maintains stable operation from cryogenic space environments to sun-facing satellite surfaces.The 827-BFBGA, FCBGA package features hermetic sealing and gold-plated contacts for reliability in vacuum conditions.Available in 827-FCBGA (24x24), the device meets MIL-PRF-38535 Class K requirements for space applications.
Product Attributes
- Product Status: Active
- Architecture: DSP, MCU, MPU
- Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
- Flash Size: -
- RAM Size: 1.5MB
- Peripherals: DMA, PWM, WDT
- Connectivity: I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB
- Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 827-BFBGA, FCBGA
- Supplier Device Package: 827-FCBGA (24x24)
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