DSC1123AI1-100.0000

Microchip Technology

General info

Part Number

DSC1123AI1-100.0000

Manufacturer

Microchip Technology

Description:

MEMS OSC XO 100.0000MHZ LVDS SMD

Datasheet:

DSC1123AI1-100.0000 PDF

Reference Price (USD)

$2.86500

500+

$2.83635

1000+

$2.8077

1500+

$2.77905

2000+

$2.7504

2500+

$2.72175

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

DSC1123AI1-100.0000

$2.86

Product details

Designed for mission-critical timing applications, Microchip Technology's DSC1123AI1-100.0000 redefines performance standards in the Oscillators market segment. This crystal-based solution delivers industry-leading phase noise performance for advanced telecommunications infrastructure.The MEMS implementation features proprietary stress-relief packaging that improves MTBF by 30% over conventional designs in base station applications.This XO (Standard) incorporates a digital control interface that enables 0.1ppm frequency resolution for software-defined test equipment calibration.Supporting 100 MHz operation with <-150dBc/Hz phase noise at 1MHz offset, the oscillator meets 6G research prototype requirements.Enable/Disable capability supports clock gating architecture in AI accelerator chips, reducing dynamic power consumption by 15%.The LVDS driver stage implements active impedance matching, eliminating the need for external termination in high-speed backplane designs.Operating from 2.25V ~ 3.63V, the device includes built-in power sequencing for safe startup in multi-rail server motherboards.Achieving ±50ppm stability with 0.01ppb/day aging rate, the oscillator serves as primary reference in atomic clock systems.With -40°C ~ 85°C operational range, the device maintains frequency lock during rapid thermal cycling in semiconductor test handlers.The 32mA maximum current specification includes power-saving modes for energy-conscious data center implementations.Compliant with AEC-Q100 standards, the device undergoes radiation testing for satellite payload timing subsystems.Surface Mount configuration features reinforced solder joints that survive 5,000 thermal cycles in solar inverter applications.The 6-SMD, No Lead Exposed Pad package integrates a copper heat spreader for optimal thermal management in compact mmWave radios.0.276" L x 0.197" W (7.00mm x 5.00mm) dimensions comply with IEEE 1588 boundary clock implementation guidelines for power substation automation.The 0.035" (0.90mm) low-profile design enables stacking in high-density server timing cards.