EKA201N00320602000

TE Intercontec

General info

Part Number

EKA201N00320602000

Manufacturer

TE Intercontec

Description:

CONN RCP HSG ML 9P INLINE PNL MT

Reference Price (USD)

$20.96000

500+

$20.7504

1000+

$20.5408

1500+

$20.3312

2000+

$20.1216

2500+

$19.912

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

EKA201N00320602000

$20.96

Product details

The EKA201N00320602000 by TE Intercontec delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Receptacle Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Male Pins implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 9 (5 + 3 Power + PE) configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.The Free Hanging (In-Line); Panel Mount installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.The Flange design enables hermetic sealing to 10^-11 atm-cc/s leak rate. The indium-sealed interface withstands 1000 thermal cycles from 300K to 4K.Bayonet Lock mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring Keyed polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.The Zinc Die Cast construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.Nickel surface treatment maintains <0.1 contact resistance at 4K. The coating withstands 1000+ vacuum cycles without degradation.The Silver coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Rated IP66/IP67 - Dust Tight, Water Resistant, Waterproof, the design maintains 10^-10 Torr vacuum integrity. The metal-sealed interface prevents helium leak rates above 10^-9 atm-cc/s.Compliant with UL94 V-0 standards, the materials produce zero toxic outgassing. Critical for cleanroom applications requiring NASA outgassing compliance.Integrated Backshell, Cable Clamp include superconducting contacts for zero-resistance signal paths. The niobium-titanium alloy contacts transition below 9.3K critical temperature.Shielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.