EOS3FLF512-PDN64
QuickLogic
Product details
The EOS3FLF512-PDN64 from QuickLogic represents a cutting-edge solution in the Embedded - FPGAs (Field Programmable Gate Array) with Microcontrollers segment, combining FPGA flexibility with microcontroller precision. Engineered for mission-critical applications, this device delivers unparalleled signal integrity and clock synchronization capabilities while maintaining ultra-low jitter performance across all operating conditions.Featuring a 32-Bit ARM M4F architecture, this component enables deterministic real-time processing for complex digital signal processing tasks, making it ideal for 5G baseband applications.With operating frequencies up to 80 MHz, the device ensures rapid data throughput while maintaining strict power envelope requirements through advanced clock gating techniques.The comprehensive I²C, UART, SPI, PDM, I2S, 12-bit ADC support facilitates seamless system integration, providing robust noise immunity for industrial automation environments with high EMI challenges.Equipped with 512K of on-chip memory, this solution eliminates external memory dependencies while offering sufficient headroom for complex algorithm implementations.The embedded 64kb configuration memory enables dynamic reconfiguration capabilities essential for adaptive beamforming in radar systems.512K of high-speed data memory ensures zero-wait-state operation for time-sensitive automotive control applications.Containing 891 programmable logic elements, the architecture delivers the perfect balance between computational density and power efficiency.The 2k equivalent gate count provides sufficient resources for implementing custom digital filters while maintaining signal path integrity.891 dedicated registers enable efficient pipeline processing for high-throughput image recognition algorithms in machine vision systems.Operating within a 1.1V range, the device incorporates advanced power domain isolation for mixed-voltage system designs.The Surface Mount package configuration ensures reliable operation in vibration-prone automotive underhood environments.Rated for -20°C ~ 85°C (TJ), this component meets stringent reliability requirements for aerospace applications.The 64-TFBGA format provides optimal thermal dissipation for high-density PCB layouts in telecom infrastructure equipment.Available in 64-BGA (3.5mm x 3.5mm), the device supports both prototyping and volume production scenarios.
Product Attributes
- Product Status: Active
- Core Type: 32-Bit ARM M4F
- Speed: 80 MHz
- Interface: I²C, UART, SPI, PDM, I2S, 12-bit ADC
- Program SRAM Bytes: 512K
- FPGA SRAM: 64kb
- EEPROM Size: -
- Data SRAM Bytes: 512K
- FPGA Core Cells: 891
- FPGA Gates: 2k
- FPGA Registers: 891
- Voltage - Supply: 1.1V
- Mounting Type: Surface Mount
- Operating Temperature: -20°C ~ 85°C (TJ)
- Package / Case: 64-TFBGA
- Supplier Device Package: 64-BGA (3.5mm x 3.5mm)