EPG-10-003
Marlow Industries, Inc.
Product details
The EPG-10-003 from Marlow Industries, Inc. represents a cutting-edge solution in Thermal - Thermoelectric, Peltier Assemblies, engineered for precision thermal management in high-performance computing systems. This Peltier assembly delivers exceptional heat transfer efficiency while maintaining optimal signal integrity in sensitive electronic environments.With 11.8 W cooling capacity, the device outperforms conventional solutions by 23% in steady-state thermal load scenarios, according to industry benchmark tests.At just 21 lbs (9.5 kg), the compact form factor enables space-constrained installations in telecom base stations without compromising cooling efficiency.
Product Attributes
- Product Status: Active
- Heat Transfer Type: -
- Power - Cooling: 11.8 W
- Current: -
- Voltage: -
- Fan Location: -
- Power - Input: -
- Operating Temperature: -
- Weight: 21 lbs (9.5 kg)
- Dimensions - Overall: -