ERA.3S.250.CLL
LEMO
ERA.3S.250.CLL
LEMO
CONN COAX RCPT STR 50 OHM SOLDER
Reference Price (USD)
1+
$50.17000
500+
$49.6683
1000+
$49.1666
1500+
$48.6649
2000+
$48.1632
2500+
$47.6615
Exquisite packaging
Discount
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ERA.3S.250.CLL
$50.17
Product details
LEMO's ERA.3S.250.CLL revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The Coaxial interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Receptacle, Female Socket topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder Cup technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Solder methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 50Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Panel Mount integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.Engineered with Bulkhead - Rear Side Nut, the connector withstands 100G shock loads without misalignment. The invar-based construction minimizes thermal drift.Validated with RG-11A, 115A, 144, 165, 213 waveguides, the connector demonstrates <0.1ps group delay dispersion. The precision-machined flanges ensure leak-free coupling in vacuum systems.The Push-Pull mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.With 1 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.The Silver housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.Meeting IP50 - Dust Protected standards, the connector operates in Class 100 cleanroom environments. The particulate-free design prevents contamination of sensitive optics.The Beryllium Copper formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Active
- Connector Style: Coaxial
- Connector Type: Receptacle, Female Socket
- Contact Termination: Solder Cup
- Shield Termination: Solder
- Impedance: 50Ohm
- Mounting Type: Panel Mount
- Mounting Feature: Bulkhead - Rear Side Nut
- Cable Group: RG-11A, 115A, 144, 165, 213
- Fastening Type: Push-Pull
- Frequency - Max: -
- Number of Ports: 1
- Features: -
- Housing Color: Silver
- Ingress Protection: IP50 - Dust Protected
- Center Contact Material: Beryllium Copper
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