FCF-114-02-L-D-01-SL

Samtec Inc.'s FCF-114-02-L-D-01-SL sets new benchmarks in Memory Connectors - PC Card Sockets technology, specifically developed for mission-critical automotive electronics. This ruggedized connector system delivers unmatched reliability in extreme temperature conditions while maintaining signal integrity for ADAS applications.The 28 contact array has been optimized for automotive power distribution requirements. Gold-plated power contacts support up to 5A continuous current while maintaining low contact resistance.The Header, Male Pins design incorporates IP67-rated sealing when mated, providing complete protection against dust and water ingress. This makes it ideal for under-hood applications in electric vehicles.Engineered with Push In, Push Out operation, the connector ensures positive engagement even with gloved hands. The tactile feedback mechanism meets human-machine interface requirements for industrial applications.The Through Hole variant features reinforced mounting points capable of withstanding 50G mechanical shock. This exceeds typical automotive requirements for crash survivability.The inclusion of Board Guide provides active thermal management capabilities. Integrated temperature sensors enable real-time monitoring of connection integrity in high-current applications.With a 0.250" (6.35mm) profile, the connector fits within tight packaging constraints of modern vehicle ECUs. The low-stack design doesn't compromise on wire strain relief capabilities.The Normal, Standard - Top option allows for flexible PCB layout in space-constrained modules. Reverse-mounted versions enable direct connection to aluminum heat sinks for improved thermal performance.The Gold surface treatment has been validated for 150 C continuous operation. This specialized plating maintains stable contact resistance across the automotive temperature range.Precision-controlled 10.0µin (0.25µm) ensures consistent performance through the connector's lifecycle. The optimized thickness balances wear resistance with cost-effectiveness for high-volume production.