FF02S55SV1
JAE Electronics
FF02S55SV1
JAE Electronics
CONN FPC BOTTOM 55POS 0.30MM R/A
Reference Price (USD)
1+
$8.43596
500+
$8.3516004
1000+
$8.2672408
1500+
$8.1828812
2000+
$8.0985216
2500+
$8.014162
Exquisite packaging
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FF02S55SV1
$8.44
Product details
JAE Electronics's FF02S55SV1 sets new benchmarks in FFC, FPC (Flat Flexible) Connectors technology, optimized for mission-critical signal transmission. This high-reliability connector combines advanced materials science with precision engineering to deliver unmatched performance in 5G infrastructure applications.Designed specifically for FPC implementations, this connector features impedance-matched signal paths. The embedded shielding technology reduces EMI by 15dB compared to standard designs.The Surface Mount, Right Angle configuration enables high-speed pick-and-place assembly. Vision-system compatible fiducials ensure 0.05mm placement accuracy.Engineered with Contacts, Bottom topology, this solution provides 360 shielding effectiveness. The multi-point contact system distributes current flow evenly.Supporting 55 contact positions, this high-density interconnect maintains 100 differential impedance. The staggered contact arrangement minimizes crosstalk.The 0.012" (0.30mm) micro-pitch design incorporates anti-wicking barriers for solder control. Laser-trimmed contacts ensure coplanarity within 0.08mm tolerance.Solder process features lead-free solder compatibility. The thermal mass balanced design prevents tombstoning during reflow.Accommodating 0.12mm cable thicknesses, the strain-relief system withstands 5N pull force. The graduated clamping pressure prevents cable deformation.With 0.035" (0.88mm) vertical clearance, this solution enables stacked PCB configurations. The low-insertion-force design requires <2N mating force.The Flip Lock system provides positive engagement feedback. Vibration testing confirms performance to 15G RMS (10-2000Hz).Straight interface design incorporates color-coded polarization. The chamfered entry guides facilitate blind mating operations.Copper Alloy formulation delivers stable contact resistance over temperature. The beryllium-free alloy meets EU Directive 2011/65/EU requirements.The Gold plating achieves <10m initial contact resistance. The 50 gold flash over nickel barrier prevents fretting corrosion.Liquid Crystal Polymer (LCP) compound provides excellent dielectric properties. The glass-reinforced structure maintains rigidity in high-temperature environments.Constructed from Polyphenylene Sulfide (PPS), the actuator mechanism withstands 10,000 cycles. The lubricant-free design prevents contamination in cleanroom applications.Zero Insertion Force (ZIF) implementation includes ESD protection up to 15kV. The auto-eject mechanism prevents cable damage during disconnection.Tested at 50V with 1000V dielectric withstand. The insulated barrier design prevents arc-over in humid conditions.Qualified for -40°C ~ 85°C operation, this connector maintains mechanical stability. Thermal shock testing confirms performance from -65 C to 150 C.Meeting UL94 V-0 requirements, the material formulation produces minimal smoke density. The self-extinguishing properties exceed FAA standards.
Product Attributes
- Product Status: Active
- Flat Flex Type: FPC
- Mounting Type: Surface Mount, Right Angle
- Connector/Contact Type: Contacts, Bottom
- Number of Positions: 55
- Pitch: 0.012" (0.30mm)
- Termination: Solder
- FFC, FCB Thickness: 0.12mm
- Height Above Board: 0.035" (0.88mm)
- Locking Feature: Flip Lock
- Cable End Type: Straight
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Housing Material: Liquid Crystal Polymer (LCP)
- Actuator Material: Polyphenylene Sulfide (PPS)
- Features: Zero Insertion Force (ZIF)
- Voltage Rating: 50V
- Operating Temperature: -40°C ~ 85°C
- Material Flammability Rating: UL94 V-0
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