FHE35-35-26/T710/T
CTS Thermal Management Products
FHE35-35-26/T710/T
CTS Thermal Management Products
FAN AXIAL 34.6X26.6MM 5VDC 2510
Reference Price (USD)
1+
$38.94000
500+
$38.5506
1000+
$38.1612
1500+
$37.7718
2000+
$37.3824
2500+
$36.993
Exquisite packaging
Discount
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FHE35-35-26/T710/T
$38.94
Product details
The FHE35-35-26/T710/T from CTS Thermal Management Products represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Featuring Push Pin and Thermal Tape options, the mounting system accommodates various PCB thicknesses (0.8-2.4mm). For mission-critical applications, the bolt-on version provides vibration resistance exceeding MIL-STD-810G standards.The Square Fins configuration maximizes surface area-to-volume ratio, achieving {Thermal Resistance @ Forced Air Flow} at minimal airflow. Computational fluid dynamics analysis confirms 20% better laminar flow characteristics than rectangular alternatives.With a compact 1.378" (35.00mm) profile, this heatsink fits space-constrained designs common in edge computing devices. The optimized aspect ratio prevents airflow stagnation in dense server configurations.The 1.378" (35.00mm) dimension complements standard PCB layouts while providing sufficient mass for heat absorption. Thermal imaging shows uniform temperature distribution across the entire surface area.Precision-engineered 1.023" (26.00mm) creates optimal boundary layer separation, enhancing convective heat transfer. This parameter is particularly crucial for natural convection cooling scenarios.With 1.65°C/W in passive cooling scenarios, the design eliminates fan requirements in many applications. The fin spacing is optimized for natural convection currents.
Product Attributes
- Product Status: Active
- Type: Board Level with Fan
- Package Cooled: -
- Attachment Method: Clip, Tape
- Shape: Square, Fins
- Length: 1.378" (35.00mm)
- Width: 1.378" (35.00mm)
- Diameter: -
- Fin Height: 1.023" (26.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 1.65°C/W
- Material: -
- Material Finish: -
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