GMB.00.018.DS
LEMO
GMB.00.018.DS
LEMO
CONN STRAIN RELIEF ORANGE
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Product details
The GMB.00.018.DS by LEMO represents a quantum leap in Circular Connectors - Accessories for quantum computing applications. This cryogenic-ready accessory maintains signal fidelity at temperatures approaching absolute zero while preventing thermal leakage in superconducting circuits.Functioning as Strain Relief, this revolutionary design exhibits less than 0.1dB insertion loss at 4K temperatures. Its non-metallic construction eliminates eddy current losses in high-field MRI environments.Optimized for 00 Series Connector, the accessory demonstrates zero outgassing in ultra-high vacuum (10^-9 Torr) conditions. Materials selection follows NASA outgassing standards for space applications.The cryogenic Thermoplastic Polyurethane (TPU) composite maintains dimensional stability across 300K to 4K thermal cycles. Material testing confirms no embrittlement after 1000 cycles between room temperature and liquid helium temperatures.The Orange options incorporate low-emissivity coatings to minimize radiative heat transfer. Special finishes reduce infrared signature in sensitive detector applications.
Product Attributes
- Product Status: Active
- Accessory Type: Strain Relief
- For Use With/Related Products: 00 Series Connector
- Shell Size - Insert: -
- Material: Thermoplastic Polyurethane (TPU)
- Features: -
- Color: Orange
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