GPEMI1.0-0.125-01-0816
Bergquist
GPEMI1.0-0.125-01-0816
Bergquist
THERM PAD 406.4MMX203.2MM BLACK
Reference Price (USD)
1+
$286.17000
500+
$283.3083
1000+
$280.4466
1500+
$277.5849
2000+
$274.7232
2500+
$271.8615
Exquisite packaging
Discount
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GPEMI1.0-0.125-01-0816
$286.17
Product details
Bergquist's GPEMI1.0-0.125-01-0816 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Gap Filler Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Rectangular configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 406.40mm x 203.20mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.125" (3.18mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.Featuring Tacky - One Side properties, this solution offers reliable component bonding without outgassing concerns. This characteristic is critical for maintaining clean environments in precision RF assemblies.The Fiberglass reinforcement provides excellent dimensional stability during handling. This feature is particularly valuable for large-area applications requiring precise material placement.The Black coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.Delivering 1.0W/m-K performance, this solution enables more efficient thermal designs for high-power RF applications. The material's consistent performance helps maintain signal integrity in sensitive circuits.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 406.40mm x 203.20mm
- Thickness: 0.125" (3.18mm)
- Material: -
- Adhesive: Tacky - One Side
- Backing, Carrier: Fiberglass
- Color: Black
- Thermal Resistivity: -
- Thermal Conductivity: 1.0W/m-K
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